Thermal conduction principle and device for intercrossed structure having different thermal characteristics

ABSTRACT

The present invention relates to relay thermal conductor made of material having better thermal conductivity coefficient, wherein which is thermal conductively coupled with heating or cooling first thermal body at one end or face thereof, and is coupled with interface thermal conductor having higher specific heat capacity at the other end or face thereof; the relay thermal conductor directly performs thermal conduction with second thermal body at another part thereof; and the interface thermal conductor having higher specific heat capacity is the thermal conducting carrier between the relay thermal conductor and the second thermal body.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Continuation-In-Part of U.S. patent applicationSer. No. 12/219,475, filed Jul. 23, 2008 and Ser. No. 12/232,278, filedSep. 15, 2008.

BACKGROUND OF THE INVENTION

(a) Field of the Invention

The present invention discloses that at least two layers of thermalenergy conducting structures in particular intercrossed overlappinglayers embodiment are commonly constituted by at least two thermalenergy conductive material having at least one of different thermalconductivity coefficient, specific heat capacity, or thermal emissivity,thereby promoting the thermal conducting effect.

(b) Description of the Prior Art

The cooling or heating source of the first thermal body of theconventional thermal conducting structure constituted by a singlematerial is usually limited by the smaller thermally conducting area ofthe thermal conducting device, such as that if the heat source of firstthermal body is the thermal energy of the heat loss in CPU of computer,or power semiconductor, or light emitting diode (LED), except for heatpipe or other cooling or heating device of the like having full areacontact in the enclosed space, then if it is coupled with said thermalbodies for heat dissipating operation, if the thermal conductingstructure is made of single material, and even if the thermalconductivity coefficient of the single material is better, its specificheat capacity is usually not the best, such as that the heat dissipaterof CPU, power semiconductor, or light emitting diodes being made ofcopper material is heavier and expensive, and it has a better thermalconductivity coefficient, but its specific heat capacity is lower thanaluminum.

If single material of better specific heat capacity with lighter weightand lower price is adopted, such as the heat dissipator of CPU, powersemiconductor or light emitting diode being made of aluminum, it hashigher specific heat capacity and thermal emissivity, but its thermalconductivity coefficient is lower than that of copper material,therefore the thermal conducting effect for thermal conducting structuremade of single material is more limited.

SUMMARY OF THE INVENTION

The present invention innovatively discloses a thermal conductionprinciple and device for intercrossed structure having different thermalcharacteristics, wherein the thermal conducting structure of theparticular intercrossed overlapping layer construction is made ofmaterials with different thermal conducting characteristics and isdifferent from the conventional thermal conducting device being made ofsingle material, the relay thermal conductor of the thermal conductionprinciple and device for intercrossed structure having different thermalcharacteristics being made of material with better thermal conductivitycoefficient is thermal conductively coupled with the heating or coolingfirst thermal body at one end or surface thereof, and is coupled withinterface thermal conductor at the other end or face thereof, and theother portion is for directly thermal conduct with the second thermalbody, and the interface thermal conductor having the thermal conductingcharacteristics with all or at least one of the 1) higher specific heatcapacity relative to relay thermal conductor, or 2) a better thermalconductivity coefficient to second thermal body relative to relaythermal conductor, or 3) a better thermal emissivity to second thermalbody relative to relay thermal conductor being good is used as thethermal conducting carrier between the relay thermal conductor and thesecond thermal body, and is favorable for thermal energy conduction bythe particular intercrossed overlapping layer construction havingdifferent thermal characteristics when there is temperature differencebetween the first thermal body and the second thermal body.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of the three-layer type layer by layeroverlapping structure principle of prior art.

FIG. 2 is a schematic view of the structure principle showing thatthermal conductive interlayer (110) is additionally installed betweeninterface thermal conductor (103) and relay thermal conductor (102) inFIG. 1 of prior art.

FIG. 3 is a schematic view showing that the multi-layered structure ofthe present invention is partially cross-layered combined to be thermalconductive composing structure.

FIG. 4 is the first schematic view showing that the multi-layeredstructure of the present invention is partially cross-layered combinedto be thermal conductive composing structure.

FIG. 5 is the second schematic view showing that the multi-layeredstructure of the present invention is partially cross-layered combinedto be thermal conductive composing structure.

FIG. 6 is the third schematic view showing that the multi-layeredstructure of the present invention is partially cross-layered combinedto be thermal conductive composing structure.

FIG. 7 is the fourth schematic view showing that the multi-layeredstructure of the present invention is partially cross-layered combinedto be thermal conductive composing structure.

FIG. 8 is the fifth schematic view showing that the multi-layeredstructure of the present invention is partially cross-layered combinedto be thermal conductive composing structure.

FIG. 9 is the sixth schematic view showing that the multi-layeredstructure of the present invention is partially cross-layered combinedto be thermal conductive composing structure.

FIG. 10 is a main structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered combined to be flat-bottomed cookware.

FIG. 11 is a main structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered combined to be round-bottomed cookware.

FIG. 12 is a main structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered combined to be boiler plant.

FIG. 13 is a main structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered combined to be pot plant.

FIG. 14 is a main structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered combined to be hot pot.

FIG. 15 is a principle schematic view showing that the intercrossedmulti-layered structure of the present invention is partiallycross-layered and enveloped to be thermal conductive composingstructure.

FIG. 16 is a applied structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered and enveloped to be deep-bottomed cookware.

FIG. 17 is a applied structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered and enveloped to be bowl cookware.

FIG. 18 is a applied structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered and enveloped to be boiler plant.

FIG. 19 is a applied structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered and enveloped for pot plant.

FIG. 20 is a applied structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered and enveloped to be hot pot.

DESCRIPTION OF MAIN COMPONENT SYMBOLS

-   101: First thermal body-   102: Relay thermal conductor-   103: Interface thermal conductor-   104: Second thermal body-   110: Thermal conductive interlayer-   111: Liftable lid-   112: Boiler plant-   113: Fluid inlet/outlet interface of boiler plant

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention innovatively discloses a thermal conductionprinciple and device for intercrossed structure having different thermalcharacteristics, wherein the thermal conducting structure of theparticular intercrossed overlapping layer construction is made ofmaterials with different thermal conducting characteristics and isdifferent from the conventional thermal conducting device being made ofsingle material, wherein the relay thermal conductor of the thermalconduction principle and device for intercrossed structure havingdifferent thermal characteristics of the present invention being made ofmaterial with better thermal conductivity coefficient is thermalconductively coupled with the heating or cooling first thermal body atone end or surface thereof, and is coupled with interface thermalconductor at the other end or surface thereof, wherein the relay thermalconductor directly perform thermal conduction with the second thermalbody at another part thereof, wherein said interface thermal conductorhaving the thermal conducting characteristics with all or at least oneof the 1) higher specific heat capacity relative to relay thermalconductor, or 2) a better thermal conductivity coefficient to secondthermal body relative to relay thermal conductor, or 3) a better thermalemissivity to second thermal body relative to relay thermal conductorbeing good is used as the thermal conducting carrier between the relaythermal conductor and the second thermal body; and is favorable forthermal energy conduction by the particular intercrossed overlappinglayer construction having different thermal characteristics when thereis temperature difference between the first thermal body and the secondthermal body.

For the thermal conduction principle and device for intercrossedstructure having different thermal characteristics, besides theaforesaid layer by layer overlapping multi-layered structure, themulti-layered structure can be partially cross-layered combined underthis basis to be the composing structure for thermal conduction tofurther promote the thermal conduction function; wherein it is describedin the following:

FIG. 1 is a schematic view of the three-layer type layer by layeroverlapping structure principle of prior art.

FIG. 2 is a schematic view of the structure principle showing thatthermal conductive interlayer (110) is additionally installed betweeninterface thermal conductor (103) and relay thermal conductor (102) inFIG. 1 of prior art.

Aforementioned FIG. 1 and FIG. 2 are the basic architecture of the layerby layer overlapping multi-layer structure; As shown in FIG. 1, the heatsource of first thermal body (101) is the thermal energy of heat loss inCPU of the computer, or power semiconductor, or light emitting diode(LED) which is not directly combined with the interface thermalconductor (103); as shown in FIG. 2, the heat source of the firstthermal body (101) is the thermal energy of heat loss in CPU of thecomputer, or power semiconductor, or light emitting diode (LED) which isnot directly combined with the thermal conductive interlayer (110) orthe interface thermal conductor (103), and the relay thermal conductor(102) and the interface thermal conductor (103) also are not directlycombined; hence, based on application requirements as well asmanufacture and space considerations, the structure can be furtherpromoted by partially cross-layered combining the multi-layeredstructure to be the composing structure for thermal conduction, i.eunder the basis of FIG. 1, the thermal conducting surface of the firstthermal body (101) is not only combined with the relay thermal conductor(102), but also partially combined with the interface thermal conductor(103), wherein the position of thermal conducting surfaces of the firstthermal body (101) for combining with the relay thermal conductor (102)and the interface thermal conductor (103) can be selected according tothermal flow distribution of temperature difference and applicationconditions.

FIG. 3 is a schematic view showing that the multi-layered structure ofthe present invention is partially cross-layered combined to be thermalconductive composing structure.

Structure characteristics of cross-layer combination as shown in FIG. 3are the following:

-   -   the thermal conducting surface of the first thermal body (101)        is partially combined with the relay thermal conductor (102),        and partially combined with the interface thermal conductor        (103);    -   the thermal conducting surface of the relay thermal conductor        (102) is partially combined with the first thermal body (101),        and partially combined with the interface thermal conductor        (103);    -   the thermal conducting surface of the interface thermal        conductor (103) is partially coupled with the second thermal        body (104); and    -   the conductive area, thickness and thermal characteristics of        thermal conductive material of each cross-layer combined surface        and original multi-layer combined surface can be selected        according to thermal flow distribution of temperature difference        and application conditions; and    -   the first thermal body (101) can be the heat source or heat        absorbing body; and    -   the second thermal body (104) can be the heat absorbing body or        heat source.

FIG. 4 is the first schematic view showing that the multi-layeredstructure of the present invention is partially cross-layered combinedto be thermal conductive composing structure.

Structure characteristics of cross-layer combination as shown in FIG. 4are the following:

-   -   the thermal conducting surface of the first thermal body (101)        is partially combined with the relay thermal conductor (102),        and partially combined with the thermal conductive interlayer        (110);    -   the thermal conducting surface of the relay thermal conductor        (102) is partially combined with the first thermal body (101),        and partially combined with the thermal conductive interlayer        (110);    -   the thermal conducting surface of the thermal conductive        interlayer (110) is partially combined with the interface        thermal conductor (103), partially combined with the relay        thermal conductor (102), and partially combined with the first        thermal body (101);    -   the thermal conducting surface of the interface thermal        conductor (103) is partially combined with the thermal        conductive interlayer (110), and partially coupled with the        second thermal body (104); and    -   the conductive area, thickness and thermal characteristics of        thermal conductive material of each cross-layer combined surface        and original multi-layer combined surface can be selected        according to thermal flow distribution of temperature difference        and application conditions; and    -   the first thermal body (101) can be the heat source or heat        absorbing body; and    -   the second thermal body (104) can be the heat absorbing body or        heat source.

FIG. 5 is the second schematic view showing that the multi-layeredstructure of the present invention is partially cross-layered combinedto be thermal conductive composing structure.

Structure characteristics of cross-layer combination as shown in FIG. 5are the following:

-   -   the thermal conducting surface of the first thermal body (101)        is combined with the relay thermal conductor (102);    -   the thermal conducting surface of the relay thermal conductor        (102) is partially combined with the first thermal body (101),        partially combined with the thermal conductive interlayer (110),        and partially combined with the interface thermal conductor        (103);    -   the thermal conducting surface of the thermal conductive        interlayer (110) is partially combined with the interface        thermal conductor (103), and partially combined with the relay        thermal conductor (102);    -   the thermal conducting surface of the interface thermal        conductor (103) is partially combined with the thermal        conductive interlayer (110), partially combined with the relay        thermal conductor (102), and partially coupled with the second        thermal body (104); and    -   the conductive area, thickness and thermal characteristics of        thermal conductive material of each cross-layer combined surface        and original multi-layer combined surface can be selected        according to thermal flow distribution of temperature difference        and application conditions; and    -   the first thermal body (101) can be the heat source or heat        absorbing body; and    -   the second thermal body (104) can be the heat absorbing body or        heat source.

FIG. 6 is the third schematic view showing that the multi-layeredstructure of the present invention is partially cross-layered combinedto be thermal conductive composing structure.

Structure characteristics of cross-layer combination as shown in FIG. 6are the following:

-   -   the thermal conducting surface of the first thermal body (101)        is partially combined with the relay thermal conductor (102),        partially combined with the thermal conductive interlayer (110),        and partially combined with the interface thermal conductor        (103);    -   the thermal conducting surface of the relay thermal conductor        (102) is partially combined with the first thermal body (101),        and partially combined with the thermal conductive interlayer        (110);    -   the thermal conducting surface of the thermal conductive        interlayer (110) is partially combined with the interface        thermal conductor (103), partially combined with the relay        thermal conductor (102), and partially combined with the first        thermal body (101);    -   the thermal conducting surface of the interface thermal        conductor (103) is partially combined with the thermal        conductive interlayer (110), partially combined with the first        thermal body (101), and partially coupled with the second        thermal body (104); and    -   the conductive area, thickness and thermal characteristics of        thermal conductive material of each cross-layer combined surface        and original multi-layer combined surface can be selected        according to thermal flow distribution of temperature difference        and application conditions; and    -   the first thermal body (101) can be the heat source or heat        absorbing body; and    -   the second thermal body (104) can be the heat absorbing body or        heat source.

FIG. 7 is the fourth schematic view showing that the multi-layeredstructure of the present invention is partially cross-layered combinedto be thermal conductive composing structure.

Structure characteristics of cross-layer combination as shown in FIG. 7are the following:

-   -   the thermal conducting surface of the first thermal body (101)        is partially combined with the relay thermal conductor (102),        partially combined with the thermal conductive interlayer (110),        and partially combined with the interface thermal conductor        (103);    -   the thermal conducting surface of the relay thermal conductor        (102) is partially combined with the first thermal body (101),        partially combined with the thermal conductive interlayer (110),        and partially combined with the interface thermal conductor        (103);    -   the thermal conducting surface of the thermal conductive        interlayer (110) is partially combined with the first thermal        body (101), partially combined with the relay thermal conductor        (102), and partially combined with the interface thermal        conductor (103);    -   the thermal conducting surface of the interface thermal        conductor (103) is partially combined with the first thermal        body (101), partially combined with the relay thermal conductor        (102), partially combined with the thermal conductive interlayer        (110), and partially coupled with the second thermal body (104);        and    -   the conductive area, thickness and thermal characteristics of        thermal conductive material of each cross-layer combined surface        and original multi-layer combined surface can be selected        according to thermal flow distribution of temperature difference        and application conditions; and    -   the first thermal body (101) can be the heat source or heat        absorbing body; and    -   the second thermal body (104) can be the heat absorbing body or        heat source.

FIG. 8 is the fifth schematic view showing that the multi-layeredstructure of the present invention is partially cross-layered combinedto be thermal conductive composing structure.

Structure characteristics of cross-layer combination as shown in FIG. 8are the following:

-   -   the thermal conducting surface of the first thermal body (101)        is partially combined with the relay thermal conductor (102),        and partially combined with the interface thermal conductor        (103);    -   the thermal conducting surface of the relay thermal conductor        (102) is partially combined with the first thermal body (101),        partially combined with the thermal conductive interlayer (110),        and partially combined with the interface thermal conductor        (103);    -   the thermal conducting surface of the thermal conductive        interlayer (110) is partially combined with the relay thermal        conductor (102), and partially combined with the interface        thermal conductor (103); and    -   the thermal conducting surface of the interface thermal        conductor (103) is partially combined with the first thermal        body (101), partially combined with the relay thermal conductor        (102), partially combined with the thermal conductive interlayer        (110), and partially coupled with the second thermal body (104);        and    -   the first thermal body (101) can be the heat source or heat        absorbing body; and    -   the second thermal body (104) can be the heat absorbing body or        heat source.

FIG. 9 is the sixth schematic view showing that the multi-layeredstructure of the present invention is partially cross-layered combinedto be thermal conductive composing structure.

Structure characteristics of cross-layer combination as shown in FIG. 9are the following:

-   -   the thermal conducting surface of the first thermal body (101)        is partially combined with the relay thermal conductor (102),        partially combined with the thermal conductive interlayer (110)        and partially combined with the interface thermal conductor        (103);    -   the thermal conducting surface of the relay thermal conductor        (102) is partially combined with the first thermal body (101),        partially combined with the thermal conductive interlayer (110),        and partially combined with the interface thermal conductor        (103);    -   the thermal conducting surface of the thermal conductive        interlayer (110) is partially combined with the first thermal        body (101), partially combined with the relay thermal conductor        (102), and partially combined with the interface thermal        conductor (103);    -   the thermal conducting surface of the interface thermal        conductor (103) is partially combined with the first thermal        body (101), partially combined with the relay thermal conductor        (102), partially combined with the thermal conductive interlayer        (110), and partially coupled with the second thermal body (104);        and    -   the conductive area, thickness and thermal characteristics of        thermal conductive material of each cross-layer combined surface        and original multi-layer combined surface can be selected        according to thermal flow distribution of temperature difference        and application conditions; and    -   the first thermal body (101) can be the heat source or heat        absorbing body; and    -   the second thermal body (104) can be the heat absorbing body or        heat source.

In case of more than one layer of the thermal conductive interlayer(110), the principle of cross-layer combination for the applicationsshown in FIGS. 3-9 can be similarly deduced.

For the thermal conduction principle and device for intercrossedstructure having different thermal characteristics, the applications ofthe layer by layer overlapping multi-layer structure or the applicationsof the multi-layer structure being partially cross-layered combined canbe made to various geometric shapes according to conditions of usage.

For the thermal conduction principle and device for intercrossedstructure having different thermal characteristics, by way of specificstructure of cross-layer combination by a portion of the intercrossedmulti-layered structure, which can be applied for various appliancesheated by thermal energy of external heat source, such as cookware,boiler, or water heater, besides the applications of heat dissipating orcooling purposes, wherein it is described in the following:

FIG. 10 is a main structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered combined to be flat-bottomed cookware.

As shown in FIG. 10, the main components include:

-   -   First thermal body (101): related to thermal energy source        through conduction, and/or convection, and/or irradiation,        wherein the first thermal body (101) is constituted by various        flaming heat source device, or electric heat source device, or        heat source device through induced heat body by electromagnetic        effect or microwave effect (or the interface thermal conductor        (103) composed of induced heat material by electromagnetic        effect or microwave effect directly producing thermal energy),        or heat source device through thermal fluid indirect        transmission, or heat source device through solar energy or        other natural thermal energy, for simultaneously heating the        interface thermal conductor (103) and the relay thermal        conductor (102), and then thermal energy is transmitted to the        heated second thermal body (104) via the interface thermal        conductor (103), on the other hand, through the simultaneously        heated relay thermal conductor (102), thermal energy is diffused        to the portion of the interface thermal conductor (103) not        directly contacting with the first thermal body (101), so as to        be transmitted to the heated second thermal body (104); —Relay        thermal conductor (102): made of material with higher thermal        conductivity coefficient relative to the interface thermal        conductor (103), including metal with better thermal        conductivity such as gold, silver, copper, aluminum, etc., to be        sandwiched in the portion of the interface thermal conductor        (103) not directly contacting with the first thermal body (101),        for further diffusing the thermal energy accepted by the        interface thermal conductor (103) from the first thermal body        (101) to the portion of the interface thermal conductor (103)        not directly contacting with the first thermal body (101); and    -   Interface thermal conductor (103): made of material suitable for        contacting with the second thermal body (104) to transmit the        thermal energy accepted from the first thermal body (101) to the        second thermal body (104), including aluminum, iron, cast iron,        stainless steel, ceramics, stone, gold, etc., for transmitting        the thermal energy accepted from the first thermal body (101) to        the second thermal body (104) in flat-bottomed cookware        structure; wherein the interface thermal conductor (103) accepts        the thermal energy directly transmitted from the first thermal        body (101), and the thermal energy diffused from the portion of        the relay thermal conductor (102) contacting with the first        thermal body (101) is accepted by the portion of the interface        thermal conductor (103) which does not directly contact with the        first thermal body (101) but contacts with the relay thermal        conductor (102); and wherein    -   the above flat-bottomed cookware is not equipped with a lid, or        equipped with a liftable lid (111); and    -   by way of the above device, thermal energy is transmitted to the        second thermal body (104) in liquid, solid, or gaseous state        placed in the interface thermal conductor (103).

FIG. 11 is a main structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered combined to be round-bottomed cookware.

As shown in FIG. 11, the main components include:

-   -   First thermal body (101): related to thermal energy source        through conduction, and/or convection, and/or irradiation,        wherein the first thermal body (101) is constituted by various        flaming heat source device, or electric heat source device, or        heat source device through induced heat body by electromagnetic        effect or microwave effect (or the interface thermal conductor        (103) composed of induced heat material by electromagnetic        effect or microwave effect directly producing thermal energy),        or heat source device through thermal fluid indirect        transmission, or heat source device through solar energy or        other natural thermal energy, for simultaneously heating the        interface thermal conductor (103) and the relay thermal        conductor (102), and then thermal energy is transmitted to the        heated second thermal body (104) via the interface thermal        conductor (103), on the other hand, through the simultaneously        heated relay thermal conductor (102), thermal energy is diffused        to the portion of the interface thermal conductor (103) not        directly contacting with the first thermal body (101), so as to        be transmitted to the heated second thermal body (104);    -   Relay thermal conductor (102): made of material with higher        thermal conductivity coefficient relative to the interface        thermal conductor (103), including metal with better thermal        conductivity such as gold, silver, copper, aluminum, etc., to be        sandwiched in the portion of the interface thermal conductor        (103) not directly contacting with the first thermal body (101),        for further diffusing the thermal energy accepted by the        interface thermal conductor (103) from the first thermal body        (101) to the portion of the interface thermal conductor (103)        not directly contacting with the first thermal body (101); and    -   Interface thermal conductor (103): made of material suitable for        contacting with the second thermal body (104) to transmit the        thermal energy accepted from the first thermal body (101) to the        second thermal body (104), including aluminum, iron, cast iron,        stainless steel, ceramics, stone, gold, etc., for transmitting        the thermal energy accepted from the first thermal body (101) to        the second thermal body (104) in round-bottomed cookware        structure; wherein the interface thermal conductor (103) accepts        the thermal energy directly transmitted from the first thermal        body (101), and the thermal energy diffused from the portion of        the relay thermal conductor (102) contacting with the first        thermal body (101) is accepted by the portion of the interface        thermal conductor (103) which does not directly contact with the        first thermal body (101) but contacts with the relay thermal        conductor (102); and wherein    -   the above round-bottomed cookware is not equipped with a lid, or        equipped with the liftable lid (111); and    -   by way of the above device, thermal energy is transmitted to the        second thermal body (104) in liquid, solid, or gaseous state        placed in the interface thermal conductor (103).

FIG. 12 is a main structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered combined to be boiler plant.

As shown in FIG. 12, the main components include:

-   -   First thermal body (101): related to thermal energy source        through conduction, and/or convection, and/or irradiation,        wherein the first thermal body (101) is constituted by various        flaming heat source device, or electric heat source device, or        heat source device through induced heat body by electromagnetic        effect or microwave effect (or the interface thermal conductor        (103) composed of induced heat material by electromagnetic        effect or microwave effect directly producing thermal energy),        or heat source device through thermal fluid indirect        transmission, or heat source device through solar energy or        other natural thermal energy, for simultaneously heating the        interface thermal conductor (103) and the relay thermal        conductor (102), and then thermal energy is transmitted to the        heated second thermal body (104) via the interface thermal        conductor (103), on the other hand, through the simultaneously        heated relay thermal conductor (102), thermal energy is diffused        to the portion of the interface thermal conductor (103) not        directly contacting with the first thermal body (101), so as to        be transmitted to the heated second thermal body (104);    -   Relay thermal conductor (102): made of material with higher        thermal conductivity coefficient relative to the interface        thermal conductor (103), including metal with better thermal        conductivity such as gold, silver, copper, aluminum, etc., to be        sandwiched in the portion of the interface thermal conductor        (103) not directly contacting with the first thermal body (101),        for further diffusing the thermal energy accepted by the        interface thermal conductor (103) from the first thermal body        (101) to the portion of the interface thermal conductor (103)        not directly contacting with the first thermal body (101);    -   Interface thermal conductor (103): made of material suitable for        contacting with the second thermal body (104) to transmit the        thermal energy accepted from the first thermal body (101) to the        second thermal body (104), including aluminum, iron, cast iron,        stainless steel, ceramics, stone, gold, etc., for transmitting        the thermal energy accepted from the first thermal body (101) to        the second thermal body (104) in boiler plant (112) structure;        wherein the interface thermal conductor (103) accepts the        thermal energy directly transmitted from the first thermal body        (101), and the thermal energy diffused from the portion of the        relay thermal conductor (102) contacting with the first thermal        body (101) is accepted by the portion of the interface thermal        conductor (103) which does not directly contact with the first        thermal body (101) but contacts with the relay thermal conductor        (102); and    -   Fluid inlet/outlet interface of boiler plant (113): related to        fluid inlet/outlet interface installed at the boiler plant        (112), such as fluid inlet/outlet piping and/or control valve;        and wherein    -   the boiler plant (112) is hermetic or semi-hermetic device        heated by combustion thermal energy, electric thermal energy, or        solar thermal energy, including external combustion type        industrial heat pump or steam boiler, external combustion type        power machinery such as boiler of steam engine, boiler of        Stirling engine, solar boiler, solar water heater, stove or pot        (like tea or coffee pot) with a liftable lid heated by solar        energy, or boiler, water heater, or heater of heating system        through combustion of heavy oil, or water heater heated by        electric thermal energy or combustion of gas, alcohol, coal, or        firewood, or stove or pot (like tea or coffee pot) with a        liftable lid.

FIG. 13 is a main structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered combined to be pot plant.

FIG. 14 is a main structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered combined to be hot pot.

By way of the above device, thermal energy is transmitted to the secondthermal body (104) in liquid, solid, or gaseous state placed in theinterface thermal conductor (103).

For the thermal conduction principle and device for intercrossedstructure having different thermal characteristics, a portion of theintercrossed multi-layered structure can be applied for beingcross-layered and enveloped to be deep-bottomed cookware structure;wherein it is described in the following:

FIG. 15 is a principle schematic view showing that the intercrossedmulti-layered structure of the present invention is partiallycross-layered and enveloped to be thermal conductive composingstructure.

As shown in FIG. 15, the main components include:

-   -   First thermal body (101): related to thermal energy source        through conduction, and/or convection, and/or irradiation,        wherein the first thermal body (101) is constituted by various        flaming heat source device, or electric heat source device, or        heat source device through induced heat body by electromagnetic        effect or microwave effect (or the interface thermal conductor        (103) composed of induced heat material by electromagnetic        effect or microwave effect directly producing thermal energy),        or heat source device through thermal fluid indirect        transmission, or heat source device through solar energy or        other natural thermal energy, for heating the interface thermal        conductor (103), and then thermal energy is transmitted to the        heated second thermal body (104) via the interface thermal        conductor (103), on the other hand, through the interface        thermal conductor (103) transmitting thermal energy to the relay        thermal conductor (102) sandwiched in the interface thermal        conductor (103), thermal energy is further diffused to the        portion of the interface thermal conductor (103) not directly        contacting with the first thermal body (101), so as to be        transmitted to the heated second thermal body (104);    -   Relay thermal conductor (102): made of material with higher        thermal conductivity coefficient relative to the interface        thermal conductor (103), including metal with better thermal        conductivity such as gold, silver, copper, aluminum, etc., to be        sandwiched in the portion of the interface thermal conductor        (103) not directly contacting with the first thermal body (101),        for further diffusing the thermal energy accepted by the        interface thermal conductor (103) from the first thermal body        (101) to the portion of the interface thermal conductor (103)        not directly contacting with the first thermal body (101);    -   Interface thermal conductor (103): made of material suitable for        contacting with the second thermal body (104) to transmit the        thermal energy accepted from the first thermal body (101) to the        second thermal body (104), including aluminum, iron, cast iron,        stainless steel, ceramics, stone, gold, etc.; wherein the        interface thermal conductor (103) accepts the thermal energy        directly transmitted from the first thermal body (101), and the        thermal energy diffused from the relay thermal conductor (102),        in which the thermal energy derives from the portion of the        interface thermal conductor (103) directly contacting with the        first thermal body (101), is accepted by the portion of the        interface thermal conductor (103) which does not directly        contact with the first thermal body (101) but contacts with the        relay thermal conductor (102); and    -   by way of the above device, thermal energy is transmitted to the        second thermal body (104) in liquid, solid, or gaseous state        placed in the interface thermal conductor (103).

FIG. 16 is a applied structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered and enveloped to be deep-bottomed cookware.

As shown in FIG. 16, the main components include:

-   -   First thermal body (101): related to thermal energy source        through conduction, and/or convection, and/or irradiation,        wherein the first thermal body (101) is constituted by various        flaming heat source device, or electric heat source device, or        heat source device through induced heat body by electromagnetic        effect or microwave effect (or the interface thermal conductor        (103) composed of induced heat material by electromagnetic        effect or microwave effect directly producing thermal energy),        or heat source device through thermal fluid indirect        transmission, or heat source device through solar energy or        other natural thermal energy, for heating the interface thermal        conductor (103), and then thermal energy is transmitted to the        heated second thermal body (104) via the interface thermal        conductor (103), on the other hand, through the interface        thermal conductor (103) transmitting thermal energy to the relay        thermal conductor (102) sandwiched in the interface thermal        conductor (103), thermal energy is further diffused to the        portion of the interface thermal conductor (103) not directly        contacting with the first thermal body (101), so as to be        transmitted to the heated second thermal body (104);    -   Relay thermal conductor (102): made of material with higher        thermal conductivity coefficient relative to the interface        thermal conductor (103), including metal with better thermal        conductivity such as gold, silver, copper, aluminum, etc., to be        sandwiched in the portion of the interface thermal conductor        (103) not directly contacting with the first thermal body (101),        for further diffusing the thermal energy accepted by the        interface thermal conductor (103) from the first thermal body        (101) to the portion of the interface thermal conductor (103)        not directly contacting with the first thermal body (101); and    -   Interface thermal conductor (103): made of material suitable for        contacting with the second thermal body (104) to transmit the        thermal energy accepted from the first thermal body (101) to the        second thermal body (104), including aluminum, iron, cast iron,        stainless steel, ceramics, stone, gold, etc., for transmitting        the thermal energy accepted from the first thermal body (101) to        the second thermal body (104) in deep-bottomed cookware        structure; wherein the interface thermal conductor (103) accepts        the thermal energy directly transmitted from the first thermal        body (101), and the thermal energy diffused from the relay        thermal conductor (102), in which the thermal energy derives        from the portion of the interface thermal conductor (103)        directly contacting with the first thermal body (101), is        accepted by the portion of the interface thermal conductor (103)        which does not directly contact with the first thermal body        (101) but contacts with the relay thermal conductor (102); and        wherein    -   the above deep-bottomed cookware is not equipped with a lid, or        equipped with the liftable lid (111); and    -   by way of the above device, thermal energy is transmitted to the        second thermal body (104) in liquid, solid, or gaseous state        placed in the interface thermal conductor (103).

FIG. 17 is a applied structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered and enveloped to be bowl cookware.

As shown in FIG. 17, the main components include:

-   -   First thermal body (101): related to thermal energy source        through conduction, and/or convection, and/or irradiation,        wherein the first thermal body (101) is constituted by various        flaming heat source device, or electric heat source device, or        heat source device through induced heat body by electromagnetic        effect or microwave effect (or the interface thermal conductor        (103) composed of induced heat material by electromagnetic        effect or microwave effect directly producing thermal energy),        or heat source device through thermal fluid indirect        transmission, or heat source device through solar energy or        other natural thermal energy, for heating the interface thermal        conductor (103), and then thermal energy is transmitted to the        heated second thermal body (104) via the interface thermal        conductor (103), on the other hand, through the interface        thermal conductor (103) transmitting thermal energy to the relay        thermal conductor (102) sandwiched in the interface thermal        conductor (103), thermal energy is further diffused to the        portion of the interface thermal conductor (103) not directly        contacting with the first thermal body (101), so as to be        transmitted to the heated second thermal body (104);    -   Relay thermal conductor (102): made of material with higher        thermal conductivity coefficient relative to the interface        thermal conductor (103), including metal with better thermal        conductivity such as gold, silver, copper, aluminum, etc., to be        sandwiched in the portion of the interface thermal conductor        (103) not directly contacting with the first thermal body (101),        for further diffusing the thermal energy accepted by the        interface thermal conductor (103) from the first thermal body        (101) to the portion of the interface thermal conductor (103)        not directly contacting with the first thermal body (101); and    -   Interface thermal conductor (103): made of material suitable for        contacting with the second thermal body (104) to transmit the        thermal energy accepted from the first thermal body (101) to the        second thermal body (104), including aluminum, iron, cast iron,        stainless steel, ceramics, stone, gold, etc., for transmitting        the thermal energy accepted from the first thermal body (101) to        the second thermal body (104) in bowl cookware structure;        wherein the interface thermal conductor (103) accepts the        thermal energy directly transmitted from the first thermal body        (101), and the thermal energy diffused from the relay thermal        conductor (102), in which the thermal energy derives from the        portion of the interface thermal conductor (103) directly        contacting with the first thermal body (101), is accepted by the        portion of the interface thermal conductor (103) which does not        directly contact with the first thermal body (101) but contacts        with the relay thermal conductor (102); and wherein    -   the above bowl cookware is not equipped with a lid, or equipped        with the liftable lid (111); and    -   by way of the above device, thermal energy is transmitted to the        second thermal body (104) in liquid, solid, or gaseous state        placed in the interface thermal conductor (103).

FIG. 18 is a applied structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered and enveloped to be boiler plant.

As shown in FIG. 18, the main components include:

-   -   First thermal body (101): related to thermal energy source        through conduction, and/or convection, and/or irradiation,        wherein the first thermal body (101) is constituted by various        flaming heat source device, or electric heat source device, or        heat source device through induced heat body by electromagnetic        effect or microwave effect (or the interface thermal conductor        (103) composed of induced heat material by electromagnetic        effect or microwave effect directly producing thermal energy),        or heat source device through thermal fluid indirect        transmission, or heat source device through solar energy or        other natural thermal energy, for heating the interface thermal        conductor (103), and then thermal energy is transmitted to the        heated second thermal body (104) via the interface thermal        conductor (103), on the other hand, through the interface        thermal conductor (103) transmitting thermal energy to the relay        thermal conductor (102) sandwiched in the interface thermal        conductor (103), thermal energy is further diffused to the        portion of the interface thermal conductor (103) not directly        contacting with the first thermal body (101), so as to be        transmitted to the heated second thermal body (104);    -   Relay thermal conductor (102): made of material with higher        thermal conductivity coefficient relative to the interface        thermal conductor (103), including metal with better thermal        conductivity such as gold, silver, copper, aluminum, etc., to be        sandwiched in the portion of the interface thermal conductor        (103) not directly contacting with the first thermal body (101),        for further diffusing the thermal energy accepted by the        interface thermal conductor (103) from the first thermal body        (101) to the portion of the interface thermal conductor (103)        not directly contacting with the first thermal body (101);    -   Interface thermal conductor (103): made of material suitable for        contacting with the second thermal body (104) to transmit the        thermal energy accepted from the first thermal body (101) to the        second thermal body (104), including aluminum, iron, cast iron,        stainless steel, ceramics, stone, gold, etc., for transmitting        the thermal energy accepted from the first thermal body (101) to        the second thermal body (104) in the boiler plant (112)        structure; wherein the interface thermal conductor (103) accepts        the thermal energy directly transmitted from the first thermal        body (101), and the thermal energy diffused from the relay        thermal conductor (102), in which the thermal energy derives        from the portion of the interface thermal conductor (103)        directly contacting with the first thermal body (101), is        accepted by the portion of the interface thermal conductor (103)        which does not directly contact with the first thermal body        (101) but contacts with the relay thermal conductor (102); and    -   Fluid inlet/outlet interface of boiler plant (113): related to        fluid inlet/outlet interface installed at the boiler plant        (112), such as fluid inlet/outlet piping and/or control valve;        and wherein    -   the boiler plant (112) is hermetic or semi-hermetic device        heated by combustion thermal energy, electric thermal energy, or        solar thermal energy, including external combustion type        industrial heat pump or steam boiler, external combustion type        power machinery such as boiler of steam engine, boiler of        Stirling engine, solar boiler, solar water heater, stove or pot        (like tea or coffee pot) with a liftable lid heated by solar        energy, or boiler, water heater, or heater of heating system        through combustion of heavy oil, or water heater heated by        electric thermal energy or combustion of gas, alcohol, coal, or        firewood, or stove or pot (like tea or coffee pot) with a        liftable lid.

FIG. 19 is a applied structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered and enveloped for pot plant.

FIG. 20 is a applied structural schematic view showing that theintercrossed multi-layered structure of the present invention ispartially cross-layered and enveloped to be hot pot.

By way of the above device, thermal energy is transmitted to the secondthermal body (104) in liquid, solid, or gaseous state placed in theinterface thermal conductor (103).

The relay thermal conductor (102) as shown in the embodiments of FIGS.10˜20 further includes the following specific structure:

-   -   Relay thermal conductor (102): composed of ring structures of        circular, triangular, square, or more surface shape, wherein the        relay thermal conductor (102) combines with the bottom of the        interface thermal conductor (103) at the position facing the        first thermal body (101), the heating surface facing the first        thermal body (101) is ring-shaped with diminishing aperture        toward the heating surface of the interface thermal conductor        (103), the relay thermal conductor (102) is ring structure with        radial expansion, and the feature is that the more away from the        center of the circle, the thinner the thickness is.

For the thermal conduction principle and device for intercrossedstructure having different thermal characteristics and/or theintercrossed multi-layered structure partially cross-layered andenveloped to be thermal conductive composing structure, the thermalconducting or heat dissipating assembled structure can be constituted bythe first thermal body (101) in solid state, the relay thermal conductor(102), the interface thermal conductor (103), the second thermal body(104) in solid state, and/or the thermal conductive interlayer (110)utilizing thermal conductive material in gradually layered structurearranged according to the required thermal conductive characteristics ofthe multi-layered structure, wherein if all or partially neighboringthermal conductors constituting the thermal conducting or heatdissipating assembled structure are solid state material, the combiningmethods between the two neighboring thermal conductors include one ormore of the following:

(1) fastened by external screws and nuts; and/or

(2) mutually threaded by spiral post and spiral hole structure; and/or

(3) mutually threaded by spiral post and spiral hole structure forprestressed-clamping combination; and/or

(4) riveting combination; and/or

(5) lamination combination; and/or

(6) fastened and clamping combination; and/or

(7) adhesive combination; and/or

(8) welding combination; and/or

(9) casting combination; and/or

(10) clamping combination; and/or

(11) tabling combination; and/or

(12) powder sintering combination; and/or

(13) friction and fusion combination; and/or

(14) neighboring thermal conductors are castedly combined; and/or

(15) neighboring thermal conductors are electroplatedly combined; and/or

(16) the thermal conducting structure between neighboring thermalconductors and another thermal conductor is fixedly or movably attachingcombination; and/or

(17) neighboring thermal conductors are tightly touchingly combined bygravity; and/or

(18) neighboring thermal conductors are tightly touchingly combined byattraction of magnet device; and/or

(19) neighboring thermal conductors are combined as an enclosedstructure.

For the thermal conduction principle and device for intercrossedstructure having different thermal characteristics, one or moreauxiliary thermal conducting methods can be optionally selected to beapplied between the first thermal body (101) and the relay thermalconductor (102); or between the relay thermal conductor (102) and theinterface thermal conductor (103); or between the interface thermalconductor (103) and the second thermal body (104); or between the relaythermal conductor (102) and the thermal conductive interlayer (110) ifthermal conductive interlayer (110) installed; or between the thermalconductive interlayer (110) and the thermal conductive interlayer (110)if multiple layered thermal conductive interlayers (110) are installed;or between the thermal conductive interlayer (110) and the interfacethermal conductor (103), including:

1. to be installed with electrically insulated heat conductive piece; or

2. to be coated with thermally conductive grease; or

3. to be installed with electrically insulated thermal conductive pieceand coated with thermally conductive grease.

The thermal conduction principle and device for intercrossed structurehaving different thermal characteristics of the present invention can beapplied for various heat absorbing or dissipating, or cooling thermalconductive application devices, such as heat absorption and dissipationof various machine casings, structure casings, semiconductor components,or the heat absorption, heat dissipation or thermal energy conduction ofventilation devices, information, audio or image devices, or heatdissipation of various lamp or LED devices, or the heat absorption ordissipation or thermal energy conduction of air conditioning devices,electrical machines or engine, or heat dissipation of thermal energyconduction from frictional heat loss of the mechanical devices, or heatdissipation or thermal energy conduction of flaming, electric, or solarheater, or other home appliances, or flaming, electric, or solarcookware, or heat absorption or thermal energy conduction of boiler,boilers of external combustion type power machinery and Stirling engine,or home stoves, or cookware, or water heater heated by flaming, electricor solar energy, or heat absorption, heat dissipation or thermal energyconduction of earth layer or water thermal energy, plant or housingbuilding or building material or building structure devices, or heatabsorbing or dissipation of water tower, or heat absorption, heatdissipation or thermal energy conduction of batteries or fuel cells,etc;

or it can be applied for thermal energy conduction in home appliances,industrial products, electronic products, electrical machines ormechanical devices, power generation equipments, buildings, airconditioning devices, industrial equipments or industrial manufacturingprocess.

I claim:
 1. A multi-layer thermally conductive structure including aplurality of partially overlapping conductors having different thermalconducting characteristics, comprising: a relay thermal conductor (102)having a first surface that directly contacts and is thermally coupledwith a first thermal body (101); an interface thermal conductor (103)between said relay thermal conductor (102) and a second thermal body(104), said second thermal body (104) directly contacting only theinterface thermal conductor (103) and not the relay thermal conductor(102), said interface thermal conductor (103) having a first surfacethat directly contacts and is thermally coupled with the second thermalbody (104), said relay thermal conductor (102) and interface thermalconductor (103) conducting heat between the first thermal body (101) andthe second thermal body (104) when there is a temperature differencebetween the first thermal body (101) and the second thermal body (104),and said relay thermal conductor (102) and interface thermal conductor(103) having one of the following thermal characteristics: (i) saidinterface thermal conductor having a higher specific heat capacity thanthe relay thermal conductor (102); (ii) said interface thermal conductorhaving a coefficient of heat transfer to the second thermal body (104)that is higher than a coefficient of thermal transfer from the relaythermal conductor (102) to the second thermal body (104); and (iii) saidinterface thermal conductor having a higher thermal emissivity to thesecond thermal body (104) than the relay thermal conductor (102),wherein a thermally conductive interlayer (110) is provided between theinterface thermal conductor (103) and the relay thermal conductor (102),said thermally conductive interlayer (110) having a contact surface fordirectly contacting and being thermally coupled with at least one of therelay thermal conductor (102) and the first thermal body (101), whereinthe first thermal body (101) is either a heat absorber or a heat sourceand the second thermal body (104) is also either a heat absorber or aheat source, and wherein relative contact areas between the relaythermal conductor (102), the interface thermal conductor (103), thethermally conductive interlayer (110), and the first and second thermalbodies determines thermal conduction properties of the multi-layerthermally conductive structure, and wherein the first thermal body (101)includes a section that extends through at least one of the thermallyconductive interlayer (110) and the relay thermal conductor (102) todirectly contact the interface thermal conductor (103).
 2. Themulti-layer thermally conductive structure as claimed in claim 1,wherein the first thermal body (101) and the thermally conductiveinterlayer (110) each directly contacts a common surface of theinterface thermal conductor (103), and the relay thermal conductor (102)is installed between the thermally conductive interlayer (110) and thefirst thermal body (101).
 3. The multi-layer thermally conductivestructure as claimed in claim 2, wherein an area of contact of theinterface thermal conductor (103) with the thermally conductiveinterlayer (110) is between respective contact areas of the interfacethermal conductor (103) with the relay thermal conductor (102) and thefirst thermal body (101).
 4. The multi-layer thermally conductivestructure as claimed in claim 2, wherein an area of contact of theinterface thermal conductor (103) with the relay thermal conductor (102)is between respective contact areas of the interface thermal conductor(103) with the thermally conductive interlayer (110) and the firstthermal body (101).
 5. The multi-layer thermally conductive structure asclaimed in claim 2, wherein the thermally conductive interlayer (110)and the relay thermal conductor (102) each directly contacts a surfaceof the first thermal body (101).
 6. The multi-layer thermally conductivestructure as claimed in claim 1, comprising multiple thermallyconductive interlayers.
 7. The multi-layer thermally conductivestructure as claimed in claim 6, wherein the multiple thermallyconductive interlayers have an intercrossed construction.
 8. Themulti-layer thermally conductive structure as claimed in claim 1,wherein different layers of the multi-layer thermally conductivestructure have different geometric shapes.
 9. The multi-layer thermallyconductive structure as claimed in claim 1, wherein the multi-layerthermally conductive structure is included in one of the following heatabsorbing, heat dissipation, or cooling structures of devices: machinecasings; heat pipe structures; structural casings; semiconductorcomponents; ventilation devices; information, audio, or image devices;lamps or LED devices; air conditioning devices; electrical machines orengines; mechanical devices that produce frictional heat losses;electric heaters, home appliances, or cooking devices; flame heatingstoves; thermal energy installations; factories, houses, or otherstructures; water towers; and batteries or fuel cells.
 10. Themulti-layer thermally conductive structure as claimed in claim 1,wherein the relay thermal conductor (102) includes a ring structurehaving an aperture whose diameter decreases between a surface that facesthe first thermal body (101) and a surface that faces the interfacethermal conductor (103), and wherein a thickness of the relay thermalconductor (102) decreases with distance away from the aperture.
 11. Themulti-layer thermally conductive structure as claimed in claim 1,wherein the multi-layer thermally conductive structure is applied tocookware that lacks a lid or is equipped with a liftable lid.
 12. Themulti-layer thermally conductive structure as claimed in claim 1,wherein the relay thermal conductor (102) is made of gold, silver,copper, or aluminum.
 13. The multi-layer thermally conductive structureas claimed in claim 1, wherein the interface thermal conductor (103) ismade of aluminum, iron, cast iron, stainless steel, ceramics, stone, orgold.
 14. The multi-layer thermally conductive structure as claimed inclaim 1, wherein the multi-layer thermally conductive structure isapplied to a fluid inlet/outlet interface of a boiler, and wherein theboiler is a hermetic or semi-hermetic device.
 15. The multi-layerthermally conductive structure as claimed in claim 1, wherein theinterface thermal conductor (103) includes a liquid, solid, or gas fortransmitting thermal energy to the second thermal body (104).
 16. Themulti-layer thermally conductive structure as claimed in claim 1,wherein said thermal conductors are joined by one of the followingstructures: a. external screws or nuts; b. a mutually threaded spiralpost and hole structure; c. a prestressed-clamping combination with amutually threaded spiral post and hole structure; d. a rivet structure;e. a lamination structure; f. a fastener and clamp combinationstructure; g. an adhesive structure; h. a welded structure; i. a caststructure; j. a clamping structure; k. a table structure; l. a sinteredpowder structure; m. a friction and fusion structure; n. common castingof neighboring thermal conductors; o. an electroplating structure; P. afixed or movable attachment structure; q. a structure that involvesgravity; r. a magnetic structure; and s. an enclosure.
 17. A multi-layerthermally conductive structure including a plurality of partiallyoverlapping conductors having different thermal conductingcharacteristics, comprising: a relay thermal conductor (102) having afirst surface that directly contacts and is thermally coupled with afirst thermal body (101) and a second surface opposite and spaced fromthe first surface; an interface thermal conductor (103) between saidrelay thermal conductor (102) and a second thermal body (104), saidsecond thermal body (104) directly contacting only the interface thermalconductor (103) and not the relay thermal conductor (102), saidinterface thermal conductor (103) having a first surface that directlycontacts and is thermally coupled with the second thermal body (104) anda second surface that directly contacts the second surface of the relaythermal conductor (102), said relay thermal conductor (102) andinterface thermal conductor (103) conducting heat between the firstthermal body (101) and the second thermal body (104) when there is atemperature difference between the first thermal body (101) and thesecond thermal body (104), and said relay thermal conductor (102) andinterface thermal conductor (103) having one of the following thermalcharacteristics: (i) said interface thermal conductor having a higherspecific heat capacity than the relay thermal conductor (102); (ii) saidinterface thermal conductor having a coefficient of heat transfer to thesecond thermal body (104) that is higher than a coefficient of thermaltransfer from the relay thermal conductor (102) to the second thermalbody (104); and (iii) said interface thermal conductor having a higherthermal emissivity to the second thermal body (104) than the relaythermal conductor (102), wherein the first thermal body (101) is eithera heat absorber or a heat source and the second thermal body (104) isalso either a heat absorber or a heat source, wherein relative contactareas between the relay thermal conductor (102), the interface thermalconductor (103), and the first and second thermal bodies determinesthermal conduction properties of the multi-layer thermally conductivestructure, wherein the first thermal body (101) includes a first sectionthat directly contacts said first surface of the relay thermal conductor(102) and a central second section that extends through the relaythermal conductor (102) to directly contact the interface thermalconductor (103), and wherein the thermally conductive structure isapplied to cookware that lacks a lid or is equipped with a liftable lid.18. A multi-layer thermally conductive structure including a pluralityof partially overlapping conductors having different thermal conductingcharacteristics, comprising: a relay thermal conductor (102) having afirst surface that directly contacts and is thermally coupled with afirst thermal body (101); an interface thermal conductor (103) betweensaid relay thermal conductor (102) and a second thermal body (104), saidsecond thermal body (104) directly contacting only the interface thermalconductor (103) and not the relay thermal conductor (102), saidinterface thermal conductor (103) having a first surface that directlycontacts and is thermally coupled with the second thermal body (104) anda second surface that directly contacts the second surface of the relaythermal conductor (102), said relay thermal conductor (102) andinterface thermal conductor (103) conducting heat between the firstthermal body (101) and the second thermal body (104) when there is atemperature difference between the first thermal body (101) and thesecond thermal body (104), and said relay thermal conductor (102) andinterface thermal conductor (103) having one of the following thermalcharacteristics: (i) said interface thermal conductor having a higherspecific heat capacity than the relay thermal conductor (102); (ii) saidinterface thermal conductor having a coefficient of heat transfer to thesecond thermal body (104) that is higher than a coefficient of thermaltransfer from the relay thermal conductor (102) to the second thermalbody (104); and (iii) said interface thermal conductor having a higherthermal emissivity to the second thermal body (104) than the relaythermal conductor (102), wherein the first thermal body (101) is eithera heat absorber or a heat source and the second thermal body (104) isalso either a heat absorber or a heat source, and wherein relativecontact areas between the relay thermal conductor (102), the interfacethermal conductor (103), and the first and second thermal bodiesdetermines thermal conduction properties of the multi-layer thermallyconductive structure, and wherein the first thermal body (101) includesa first section that directly contacts said first surface of the relaythermal conductor and a central second section that extends through therelay thermal conductor (102) to directly contact the interface thermalconductor (103), and further comprising an auxiliary thermal conductorinstalled between the first thermal body (101) and the relay thermalconductor (102), between the relay thermal conductor (102) and theinterface thermal conductor (103), or between the interface thermalconductor (103) and the second thermal body (104), said auxiliarythermal conductor including one of an electrically insulated heatconductive piece, a thermally conductive grease coating, and anelectrically insulated thermally conductive piece coated with thermallyconductive grease.